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Microsystems 電子書系列

12 條結果中的 1 - 12 條 結果 结果
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  • Scanning Probe Lithography

    由 Hyongsok T. Soh, Kathryn Wilder Guarini, Calvin F. Quate ……
    系列 第 7 冊 - Microsystems
    Scanning Probe Lithography (SPL) describes recent advances in the field of scanning probe lithography, a high resolution patterning technique that uses a sharp tip in close proximity to a sample to pattern nanometer-scale features on the sample. SPL is capable of patterning sub-30nm features with nanometer-scale alignment registration. It is a relatively simple, inexpensive, reliable method for …… 閱讀更多內容

    NT$3,170 TWD

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  • Test and Measurement: Know It All

    Know It All

    由 Jon S. Wilson, Stuart Ball, Creed Huddleston, Edward Ramsden, Dogan Ibrahim ……
    系列 series Newnes Know It All
    The Newnes Know It All Series takes the best of what our authors have written to create hard-working desk references that will be an engineer's first port of call for key information, design techniques and rules of thumb. Guaranteed not to gather dust on a shelf!Field Application engineers need to master a wide area of topics to excel. The Test and Measurement Know It All covers every angle …… 閱讀更多內容

    NT$2,074 TWD

  • Radio-Frequency Electronics

    Circuits and Applications

    由 Jon B. Hagen ……
    This second, updated edition of the best-selling Radio-Frequency Electronics introduces the basic concepts and key circuits of radio-frequency systems. It covers the fundamental principles applying to all radio devices, from wireless single-chip data transceivers to high-power broadcast transmitters. This new edition is extensively revised and expanded throughout, including additional chapters on …… 閱讀更多內容

    NT$3,241 TWD

  • The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

    由 Gerard Kelly ……
    系列 series Engineering (R0)
    One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done? Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and …… 閱讀更多內容

    NT$3,170 TWD

  • Machinery's Handbook Made Easy

    由 Edward Janecek ……
    Improve Your Manufacturing SkillsMachinery's Handbook Made EasyThis is a time-saving navigational tool for Machinery’s Handbook for experienced professionals and beginners alike. You will learn how to quickly find exactly what you need from the Handbook’s vast compilation of data, standards and text. The contents are organized in an intuitive, easy-to-follow manner and are crossed-referenced to …… 閱讀更多內容

    NT$1,303 TWD

  • Shape Memory Alloy Valves

    Basics, Potentials, Design

    編輯者: Alexander Czechowicz, Sven Langbein ……
    系列 series Chemistry and Material Science (R0)
    This book introduces shape memory alloy technology with a specific focus on valve applications. The authors describe application characteristics as well the current and potential uses of this technology. They include an overview of thermal and electrical valves as well as detailed valve design strategies. …… 閱讀更多內容

    NT$2,818 TWD

  • Nanoelectronic Circuit Design

    編輯者: Deming Chen, Niraj K. Jha ……
    系列 series Engineering (R0)
    This book is about large-scale electronic circuits design driven by nanotechnology, where nanotechnology is broadly defined as building circuits using nanoscale devices that are either implemented with nanomaterials (e.g., nanotubes or nanowires) or following an unconventional method (e.g., FinFET or III/V compound-based devices). These nanoscale devices have significant potential to revolutionize …… 閱讀更多內容

    NT$3,523 TWD

  • Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

    Fundamental Mechanisms and Application to IC Interconnect Technology

    由 Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann ……
    As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for …… 閱讀更多內容

    NT$4,932 TWD

  • Optical Fiber Sensor Technology

    Applications and Systems

    編輯者: L.S. Grattan, B.T. Meggitt ……
    系列 第 3 冊 - Optoelectronics, Imaging and Sensing
    Systems and Applications in Optical Fiber Sensor Technology The essential technology which underpins developments in optical fiber sensors continues to expand, and continues to be driven to a very large extent by advances in optoelectronics which have been produced for the ever-expanding optical com munications systems and networks of the world. The steps forward in the technol ogy, often …… 閱讀更多內容

    NT$4,932 TWD

  • Advances in Sulphonation Techniques

    Liquid Sulphur Dioxide as a Solvent of Sulphur Trioxide

    由 Navin G. Ashar ……
    系列 series Chemistry and Material Science (R0)
    This book presents a complete, in-depth analysis for on the impact of liquid sulfur dioxide and liquid sulfur trioxide to carry out complex and difficult sulfonations, as well as manufacture of sulfuric acid with a CAPEX requirement of less than half, an area requirement less than one-third, and no emission of sulfur dioxide. The processes described in this volume represents an innovative approach …… 閱讀更多內容

    NT$2,290 TWD

  • Low Power Analog CMOS for Cardiac Pacemakers

    Design and Optimization in Bulk and SOI Technologies

    由 Fernando Silveira, Denis Flandre ……
    系列 series Engineering (R0)
    Low Power Analog CMOS for Cardiac Pacemakers proposes new techniques for the reduction of power consumption in analog integrated circuits. Our main example is the pacemaker sense channel, which is representative of a broader class of biomedical circuits aimed at qualitatively detecting biological signals.The first and second chapters are a tutorial presentation on implantable medical devices and …… 閱讀更多內容

    NT$3,170 TWD

  • Solder Paste in Electronics Packaging

    Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

    由 Jennie Hwang ……
    One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From …… 閱讀更多內容

    NT$3,170 TWD