Semiconductor Advanced Packaging

John H. Lau

Engineering (R0)

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言語　English
商品番号：9789811613760
発売日　2021年5月17日
出版社：Springer Nature Singapore

出版社： Springer
ファイル形式　EPUB3
サイズ　339.09 MB
ダウンロードオプション:EPUB3 (Adobe DRM)

シリーズの内容

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

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Fan-Out Wafer-Level Packaging

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Assembly and Reliability of Lead-Free Solder Joints

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Chiplet Design and Heterogeneous Integration Packaging

John H. Lau

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Semiconductor Advanced Packaging

楽天Koboで読む理由

あらすじ

この書籍について

商品情報

閲覧方法

シリーズの内容

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Fan-Out Wafer-Level Packaging

Assembly and Reliability of Lead-Free Solder Joints

Chiplet Design and Heterogeneous Integration Packaging

関連書籍

Small Antennas:Miniaturization Techniques & Applications

3d Printing And Additive Manufacturing Of Electronics: Principles And Applications

NAND Flash Memory Technologies

Proceedings of the International Conference of Fluid Power and Mechatronic Control Engineering (ICFPMCE 2022)

Electrical Connectors

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Advanced Flip Chip Packaging

Enabling the Internet of Things

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Electronics, Electrical Engineering And Information Science - Proceedings Of The 2015 International Conference (Eeeis2015)

Conducted Electromagnetic Interference (EMI) in Smart Grids

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Elements of Radio Frequency Energy Harvesting and Wireless Power Transfer Systems

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Advances in Semiconductor Technologies

The Proceedings of the 17th Annual Conference of China Electrotechnical Society

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Design, Manufacturing And Mechatronics - Proceedings Of The International Conference On Design, Manufacturing And Mechatronics (Icdmm2016)

Conference Proceedings of 2022 2nd International Joint Conference on Energy, Electrical and Power Engineering

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The Proceedings of the 9th Frontier Academic Forum of Electrical Engineering

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Synthesized Transmission Lines

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3D Microelectronic Packaging

Robust Design of Digital Circuits on Foil

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Proceedings of the 2nd International Conference on Intelligent Technologies and Engineering Systems (ICITES2013)

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Energy And Mechanical Engineering - Proceedings Of 2015 International Conference