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3D Microelectronic Packaging - From Fundamentals to Applications eBook by

3D Microelectronic Packaging

From Fundamentals to Applications

Synopsis

About this book

  • Language:English
  • ISBN:9783319445861
  • Release date:Nov 11, 2017
  • Publisher:Springer International Publishing
  • Imprint:Springer
  • File format:EPUB2
  • File size:13.05 MB
  • Download options:EPUB2 (Adobe DRM)

In this series

3D Microelectronic Packaging

Yan Li,Deepak Goyal