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3D Microelectronic Packaging - From Fundamentals to Applications eBook by

3D Microelectronic Packaging

From Fundamentals to Applications

Deepak Goyal,Yan Li

Engineering (R0)

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About this book

Language:English
ISBN:9783319445861
Release date:Jan 20, 2017
Publisher:Springer International Publishing

Imprint:Springer
File format:EPUB2
File size:13.05 MB
Download options:EPUB2 (Adobe DRM)

In this series

3D Microelectronic Packaging - eBook by Yan Li,Deepak Goyal

3D Microelectronic Packaging

Yan Li,Deepak Goyal