TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with de...

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.Introduction to Microsystem Packaging Technology

This book focuses on the topology theory of mechanisms developed by the authors and provides a systematic method for the topology design of robot mechanisms.The main original theoretical contributions of this book include:A. Three basic concepts· The “geometrical constraint type of axes” is introduced as the third element of the topological structure of a mechanism. When it is combined with the other two elements, the kinematic pair and the connection of links, the ...

D2D-based proximity service is a very hot topic with great commercial potential from an application standpoint. Unlike existing books which focus on D2D communications technologies, this book fills a gap by summarizing and analyzing the latest applications and research results in academic, industrial fields, and standardization. The authors present the architecture, fundamental issues, and applications in a D2D networking environment from both application and interdisciplinary points of vi...