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Reference Module Computer Science and Engineering eBook Series

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  • Handbook of Integrated Circuit Industry

    Edited by Yangyuan Wang, Min-Hwa Chi, Jesse Jen-Chung Lou, Chun-Zhang Chen ...
    Series series Reference Module Computer Science and Engineering
    Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated ... Read more

    PHP49,868.49

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  • Semiconductor Manufacturing Handbook, Second Edition

    by Hwaiyu Geng ...
    Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations InformationWritten by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second ... Read more

    PHP6,557.89

  • Semiconductor Manufacturing Handbook

    by Hwaiyu Geng ...
    This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines. ... Read more

    PHP8,168.49

  • Nanoscale CMOS VLSI Circuits: Design for Manufacturability

    by Sandip Kundu, Aswin Sreedhar ...
    Cutting-Edge CMOS VLSI Design for Manufacturability TechniquesThis detailed guide offers proven methods for optimizing circuit designs to increase the yield, reliability, and manufacturability of products and mitigate defects and failure. Covering the latest devices, technologies, and processes, Nanoscale CMOS VLSI Circuits: Design for Manufacturability focuses on delivering higher performance and ... Read more

    PHP6,610.39

  • Modeling, Control, and Optimization of Natural Gas Processing Plants

    by William A. Poe, Saeid Mokhatab ...
    Modeling, Control, and Optimization of Natural Gas Processing Plants presents the latest on the evolution of the natural gas industry, shining a light on the unique challenges plant managers and owners face when looking for ways to optimize plant performance and efficiency, including topics such as the various feed gas compositions, temperatures, pressures, and throughput capacities that keep them ... Read more

    PHP6,971.69

  • Process / Industrial Instruments and Controls Handbook, Sixth Edition

    by Gregory K. McMillan, P. Hunter Vegas ...
    Extensive practical plant based knowledge to achieve the best automation systemBACK COVER DESCRIPTION:This fully updated on-the-job reference contains all the automation and control information you need to make timely decisions, and maximize process capacity and efficiency. Featuring contributions from 50 top technical experts, Process/Industrial Instruments and Controls Handbook, Sixth Edition ... Read more

    PHP9,023.69

  • 3D IC Stacking Technology

    by Banqiu Wu, Sesh Ramaswami, Ajay Kumar ...
    The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry ... Read more

    PHP8,131.79

  • RF and Microwave Microelectronics Packaging

    Edited by Ken Kuang, Franklin Kim, Sean S. Cahill ...
    Series series Engineering (R0)
    RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF ... Read more

    PHP8,726.49

  • 3D Integration in VLSI Circuits

    Implementation Technologies and Applications

    Edited by Katsuyuki Sakuma ...
    Series series Devices, Circuits, and Systems
    Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are ... Read more

    PHP4,662.79

  • Three-Dimensional Integration of Semiconductors

    Processing, Materials, and Applications

    Edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi ...
    Series series Chemistry and Material Science (R0)
    This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many ... Read more

    PHP5,609.69

  • Advanced Flip Chip Packaging

    Edited by Yi-Shao Lai, C.P. Wong, Ho-Ming Tong ...
    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better ... Read more

    PHP8,726.49

  • Applied Mechanics, Mechatronics And Intelligent Systems - Proceedings Of The 2015 International Conference (Ammis2015)

    by Shihong Qin, Xiaolong Li ...
    This book consists of one hundred and twenty-five selected papers presented at the 2015 International Conference on Applied Mechanics, Mechatronics and Intelligent Systems (AMMIS2015), which was held in Nanjing, China during June 19-20, 2015.AMMIS2015 focuses on seven main areas, namely, applied mechanics, control and automation, intelligent systems, computer technology, electronics engineering, ... Read more

    PHP5,666.09