Skip to main content
Search Button
台灣 Kobo 商店 禮物卡 說明
Kobo 樂天
我的願望清單

購物車

您會獲得 VIP 禮遇！

無法購買的項目
請檢閱您的購物車。您可以即刻移除無法購買的項目，或者我們將於結帳時為您自動移除。
項目項目
項目項目

專屬於您的推薦

Loading...


Reference Module Computer Science and Engineering 電子書系列

12 條結果中的 1 - 12 條 結果 结果
Skip side bar filters

  • Handbook of Integrated Circuit Industry

    編輯者: Yangyuan Wang, Min-Hwa Chi, Jesse Jen-Chung Lou, Chun-Zhang Chen ……
    系列 series Reference Module Computer Science and Engineering
    Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated …… 閱讀更多內容

    NT$28,185 TWD

閱讀這些書的人也喜歡

  • Semiconductor Manufacturing Handbook, Second Edition

    由 Hwaiyu Geng ……
    Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations InformationWritten by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second …… 閱讀更多內容

    NT$3,707 TWD

  • LED Packaging for Lighting Applications

    Design, Manufacturing, and Testing

    由 Xiaobing Luo, Shen Liu ……
    Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high …… 閱讀更多內容

    NT$4,127 TWD

  • Electrical Connectors

    Design, Manufacture, Test, and Selection

    編輯者: San Kyeong, Michael G. Pecht ……
    系列 series IEEE Press
    Discover the foundations and nuances of electrical connectors in this comprehensive and insightful resourceElectrical Connectors: Design, Manufacture, Test, and Selection delivers a comprehensive discussion of electrical connectors, from the components and materials that comprise them to their classifications and underwater, power, and high-speed signal applications. Accomplished engineer and …… 閱讀更多內容

    NT$3,771 TWD

  • Semiconductor Manufacturing Handbook

    由 Hwaiyu Geng ……
    This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines. …… 閱讀更多內容

    NT$4,617 TWD

  • Nanoscale CMOS VLSI Circuits: Design for Manufacturability

    由 Sandip Kundu, Aswin Sreedhar ……
    Cutting-Edge CMOS VLSI Design for Manufacturability TechniquesThis detailed guide offers proven methods for optimizing circuit designs to increase the yield, reliability, and manufacturability of products and mitigate defects and failure. Covering the latest devices, technologies, and processes, Nanoscale CMOS VLSI Circuits: Design for Manufacturability focuses on delivering higher performance and …… 閱讀更多內容

    NT$3,737 TWD

  • Process / Industrial Instruments and Controls Handbook, Sixth Edition

    由 Gregory K. McMillan, P. Hunter Vegas ……
    Extensive practical plant based knowledge to achieve the best automation systemBACK COVER DESCRIPTION:This fully updated on-the-job reference contains all the automation and control information you need to make timely decisions, and maximize process capacity and efficiency. Featuring contributions from 50 top technical experts, Process/Industrial Instruments and Controls Handbook, Sixth Edition …… 閱讀更多內容

    NT$5,100 TWD

  • 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

    由 Lih-Tyng Hwang, Tzyy-Sheng Jason Horng ……
    系列 series IEEE Press
    An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessmentsFeatures an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobilityPresents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and MinitabFundamental design …… 閱讀更多內容

    NT$3,344 TWD

  • 3D IC Stacking Technology

    由 Banqiu Wu, Sesh Ramaswami, Ajay Kumar ……
    The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry …… 閱讀更多內容

    NT$4,597 TWD

  • RF and Microwave Microelectronics Packaging

    編輯者: Ken Kuang, Franklin Kim, Sean S. Cahill ……
    系列 series Engineering (R0)
    RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF …… 閱讀更多內容

    NT$4,932 TWD

  • 3D Integration in VLSI Circuits

    Implementation Technologies and Applications

    編輯者: Katsuyuki Sakuma ……
    系列 series Devices, Circuits, and Systems
    Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are …… 閱讀更多內容

    NT$2,636 TWD

  • Three-Dimensional Integration of Semiconductors

    Processing, Materials, and Applications

    編輯者: Kazuo Kondo, Morihiro Kada, Kenji Takahashi ……
    系列 series Chemistry and Material Science (R0)
    This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many …… 閱讀更多內容

    NT$3,170 TWD