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Reference Module Computer Science and Engineering Bogserier

1 - 12 af 12 resultater
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  • Handbook of Integrated Circuit Industry

    Redigeret af Yangyuan Wang, Min-Hwa Chi, Jesse Jen-Chung Lou, Chun-Zhang Chen ...
    Serier serie Reference Module Computer Science and Engineering
    Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated ... Læs mere

    6.724,49 kr.

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  • Semiconductor Manufacturing Handbook, Second Edition

    af Hwaiyu Geng ...
    Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations InformationWritten by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second ... Læs mere

    982,54 kr.

  • LED Packaging for Lighting Applications

    Design, Manufacturing, and Testing

    af Xiaobing Luo, Shen Liu ...
    Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high ... Læs mere

    984,49 kr.

  • Electrical Connectors

    Design, Manufacture, Test, and Selection

    Redigeret af San Kyeong, Michael G. Pecht ...
    Serier serie IEEE Press
    Discover the foundations and nuances of electrical connectors in this comprehensive and insightful resourceElectrical Connectors: Design, Manufacture, Test, and Selection delivers a comprehensive discussion of electrical connectors, from the components and materials that comprise them to their classifications and underwater, power, and high-speed signal applications. Accomplished engineer and ... Læs mere

    899,61 kr.

  • Semiconductor Manufacturing Handbook

    af Hwaiyu Geng ...
    This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines. ... Læs mere

    1.223,86 kr.

  • Nanoscale CMOS VLSI Circuits: Design for Manufacturability

    af Sandip Kundu, Aswin Sreedhar ...
    Cutting-Edge CMOS VLSI Design for Manufacturability TechniquesThis detailed guide offers proven methods for optimizing circuit designs to increase the yield, reliability, and manufacturability of products and mitigate defects and failure. Covering the latest devices, technologies, and processes, Nanoscale CMOS VLSI Circuits: Design for Manufacturability focuses on delivering higher performance and ... Læs mere

    990,40 kr.

  • Process / Industrial Instruments and Controls Handbook, Sixth Edition

    af Gregory K. McMillan, P. Hunter Vegas ...
    Extensive practical plant based knowledge to achieve the best automation systemBACK COVER DESCRIPTION:This fully updated on-the-job reference contains all the automation and control information you need to make timely decisions, and maximize process capacity and efficiency. Featuring contributions from 50 top technical experts, Process/Industrial Instruments and Controls Handbook, Sixth Edition ... Læs mere

    1.351,98 kr.

  • 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

    af Lih-Tyng Hwang, Tzyy-Sheng Jason Horng ...
    Serier serie IEEE Press
    An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessmentsFeatures an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobilityPresents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and MinitabFundamental design ... Læs mere

    797,74 kr.

  • 3D IC Stacking Technology

    af Banqiu Wu, Sesh Ramaswami, Ajay Kumar ...
    The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry ... Læs mere

    1.218,35 kr.

  • RF and Microwave Microelectronics Packaging

    Redigeret af Ken Kuang, Franklin Kim, Sean S. Cahill ...
    Serier serie Engineering (R0)
    RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF ... Læs mere

    1.307,45 kr.

  • 3D Integration in VLSI Circuits

    Implementation Technologies and Applications

    Redigeret af Katsuyuki Sakuma ...
    Serier serie Devices, Circuits, and Systems
    Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are ... Læs mere

    643,63 kr.

  • Three-Dimensional Integration of Semiconductors

    Processing, Materials, and Applications

    Redigeret af Kazuo Kondo, Morihiro Kada, Kenji Takahashi ...
    Serier serie Chemistry and Material Science (R0)
    This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many ... Læs mere

    756,49 kr.