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Edición de Ashish Raman, Deep Shekhar, Naveen Kumar ...

This comprehensive reference text discusses novel semiconductor devices, including nanostructure field-effect transistors, photodiodes, high electron mobility transistors, and oxide-based devices. The text covers submicron semiconductor devices, device modeling, novel materials for devices, novel semiconductor devices, optimization techniques, and their application in detail. It covers such ... Leer más

$1,591 MXN

This comprehensive reference text discusses novel semiconductor devices, including nanostructure field-effect transistors, photodiodes, high electron mobility transistors, and oxide-based devices. The text covers submicron semiconductor devices, device modeling, novel materials for devices, novel semiconductor devices, optimization techniques, and their application in detail. It covers such
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Practical Guide to the Packaging of Electronics

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Successfully Estimate the Thermal and Mechanical Characteristics of Electronics SystemsA definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed ... Leer más

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Successfully Estimate the Thermal and Mechanical Characteristics of Electronics SystemsA definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime ... Leer más

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime
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Power Electronic Modules

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3D Integration in VLSI Circuits

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Edición de Katsuyuki Sakuma ...

Series series Devices, Circuits, and Systems
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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are
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Measurement and Modeling of Silicon Heterostructure Devices

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When you see a nicely presented set of data, the natural response is: “How did they do that; what tricks did they use; and how can I do that for myself?” Alas, usually, you must simply keep wondering, since such tricks-of- the-trade are usually held close to the vest and rarely divulged. Shamefully ignored in the technical literature, measurement and modeling of high-speed semiconductor devices is ... Leer más

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High-Speed Photonic Devices

Edición de Nadir Dagli ...

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Biosensors

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Series series Series in Sensors
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Advanced Nanoelectronics

Edición de Razali Ismail, Mohammad Taghi Ahmadi, Sohail Anwar ...

Series series Nano and Energy
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Influence of Temperature on Microelectronics and System Reliability

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de Pradeep Lall, Edward B. Hakim, Michael G. Pecht ...

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de Eugenio Culurciello ...

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Series Libro 7 - The Wiley Microsystem and Nanotechnology Series
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Beyond-CMOS Nanodevices 2

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This book offers a comprehensive review of the state-of-the-art in innovative Beyond-CMOS nanodevices for developing novel functionalities, logic and memories dedicated to researchers, engineers and students. The book will particularly focus on the interest of nanostructures and nanodevices (nanowires, small slope switches, 2D layers, nanostructured materials, etc.) for advanced More than Moore
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The Race For A New Game Machine:

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**The pioneering game-chip engineers behind the revolutionary Cell microprocessor tell the story of its creation in this “fast-paced tell-all” (**Steve Cherry, IEEE Spectrum Magazine).The Xbox 360 and PlayStation 3 game systems have changed the face of home entertainment. But few know the amazing story inside the consoles—how David Shippy and his team of engineers at the Sony/Toshiba/IBM Design ... Leer más

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**The pioneering game-chip engineers behind the revolutionary Cell microprocessor tell the story of its creation in this “fast-paced tell-all” (**Steve Cherry, IEEE Spectrum Magazine).The Xbox 360 and PlayStation 3 game systems have changed the face of home entertainment. But few know the amazing story inside the consoles—how David Shippy and his team of engineers at the Sony/Toshiba/IBM Design
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IC晶片電路製作方法

2024年中文版

de Kung Linliu ...

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Electrical Engineering 101

Everything You Should Have Learned in School...but Probably Didn't

de Darren Ashby ...

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de Guozhen Shen, Zhiyong Fan ...

This book provides a comprehensive overview of the recent development of flexible electronics. This is a fast evolving research field and tremendous progress has been made in the past decade. In this book, new material development and novel flexible device, circuit design, fabrication and characterizations will be introduced. Particularly, recent progress of nanomaterials, including carbon ... Leer más

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This book provides a comprehensive overview of the recent development of flexible electronics. This is a fast evolving research field and tremendous progress has been made in the past decade. In this book, new material development and novel flexible device, circuit design, fabrication and characterizations will be introduced. Particularly, recent progress of nanomaterials, including carbon
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Strain-Engineered MOSFETs

de C.K. Maiti, T.K. Maiti ...

Currently strain engineering is the main technique used to enhance the performance of advanced silicon-based metal-oxide-semiconductor field-effect transistors (MOSFETs). Written from an engineering application standpoint, Strain-Engineered MOSFETs introduces promising strain techniques to fabricate strain-engineered MOSFETs and to methods to assess the applications of these techniques. The book ... Leer más

Gratis

Currently strain engineering is the main technique used to enhance the performance of advanced silicon-based metal-oxide-semiconductor field-effect transistors (MOSFETs). Written from an engineering application standpoint, Strain-Engineered MOSFETs introduces promising strain techniques to fabricate strain-engineered MOSFETs and to methods to assess the applications of these techniques. The book
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Advanced Nanodielectrics

Fundamentals and Applications

Edición de Toshikatsu Tanaka, Takahiro Imai ...

This book is the translated version of Advanced Nanodielectrics: Fundamentals and Applications, which was published by the Investigating R&D Committee on Advanced Polymer Nanocomposite Dielectrics of the Institute of Electrical Engineers of Japan (IEEJ). The Japanese version is a winner of the IEEJ Outstanding Technical Report Award (2016). Nanocomposites are generally composed of host and guest ... Leer más

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This book is the translated version of Advanced Nanodielectrics: Fundamentals and Applications, which was published by the Investigating R&D Committee on Advanced Polymer Nanocomposite Dielectrics of the Institute of Electrical Engineers of Japan (IEEJ). The Japanese version is a winner of the IEEJ Outstanding Technical Report Award (2016). Nanocomposites are generally composed of host and guest
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Semiconductors and Semimetals

de Zetian Mi, Hark Hoe Tan ...

Series Libro 122 - Semiconductors and Semimetals
Semiconductors and Semimetals series, highlights new advances in the field, with this new volume presenting interesting chapters. Each chapter is written by an international board of authors. - Provides the latest information on Semiconductors and Semimetals research - Offers outstanding and original reviews on a range of Semiconductors and Semimetals research topics - Serves as an indispensable ... Leer más

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Semiconductors and Semimetals series, highlights new advances in the field, with this new volume presenting interesting chapters. Each chapter is written by an international board of authors. - Provides the latest information on Semiconductors and Semimetals research - Offers outstanding and original reviews on a range of Semiconductors and Semimetals research topics - Serves as an indispensable
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eBooks de Microelectrónica

Sub-Micron Semiconductor Devices

Practical Guide to the Packaging of Electronics

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Power Electronic Modules

3D Integration in VLSI Circuits

Measurement and Modeling of Silicon Heterostructure Devices

High-Speed Photonic Devices

Biosensors

Low-Power Processors and Systems on Chips

Advanced Nanoelectronics

Influence of Temperature on Microelectronics and System Reliability

Silicon-on-Sapphire Circuits and Systems

The Makerspace Workbench

Nano and Micromachining

Digital System Design using FSMs

Digital Holography for MEMS and Microsystem Metrology

Beyond-CMOS Nanodevices 2

The Race For A New Game Machine:

IC晶片電路製作方法

Electrical Engineering 101

Flexible Electronics: From Materials To Devices

Strain-Engineered MOSFETs

Advanced Nanodielectrics

Semiconductors and Semimetals