This is our Worldwide store.

Looks like you're in United States. You need a Worldwide address to shop on our Worldwide store. Go to our United States store to continue.

Go to United States StoreChoose another store
Skip to main content
Wishlist
Cart
Create account
Have an account?Sign in
Semiconductor Packaging - Materials Interaction and Reliability eBook by Andrea Chen,Randy Hsiao-Yu Lo

Semiconductor Packaging

Materials Interaction and Reliability

Andrea Chen,Randy Hsiao-Yu Lo

Synopsis

Categories

About this book

  • Language:English
  • ISBN:9781000218619
  • Release date:Sep 9, 2023
  • Publisher:CRC Press
  • Imprint:CRC Press
  • File format:EPUB3
  • File size:10.54 MB
  • Download options:EPUB3 (Adobe DRM)